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The purpose of this paper is to demonstrate a novel 3D system-in-package (SiP) approach. This new packaging approach is based on stacked silicon submount technology. As demonstrators, a smart lighting module and a sensor systems were successfully developed by using the fabrication and assembly process described in this paper.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. This platform consists of silicon submount design and fabrication, module packaging, system assembling and testing and analyzing.

In this paper, a smart light emitting diode system and sensor system will be described based on stacked silicon submount and 3D SiP technology. The integrated smart lighting module meets the optical requirements of general lighting applications. The developed SiP design is also implemented into the miniaturization of particular matter sensors and gas sensor detection system.

SiP has great potential of integrating multiple components into a single compact package, which has potential implementation in intelligent applications.

This study aims to provide a flexible and cost-effective solution of 3D heterogeneous integration for applications such as micro-electro-mechanical system (MEMS) applications and smart sensor systems.

A novel 3D system-in-package (SiP) based on stacked silicon submount technology was successfully developed and well-demonstrated by the fabrication and assembly process of a selected smart lighting module.

The stacked module consists of multiple layers of silicon submounts which can be designed and fabricated in parallel. The bonding and interconnecting process is quite simple and does not require complicated equipment. The 3D stacking design offers higher silicon efficiency and miniaturized package form factor. The submount wafer can be assembled and tested at the wafer level, thus reducing the cost and improving the yield.

The embedding design presented in this paper is applicable for modules with limited number of passives. When it comes to cases with more passive devices, new process needs to be developed to achieve fast, inexpensive and reliable assembly.

The presented 3D SiP design is novel for applications such as smart lighting, Internet of Things, MEMS systems, etc.

Cultural landscapes are no more considered only as territories of cultural interest but also as integrated systems of cultural, social, and economic values. The adjustment of this consideration with the modern paradigms of collective governance and management necessitates investigations on challenges of management of cultural landscapes for valorizing their resources toward sustainable development. In this framework, the purpose of this paper is to analyze the state of participatory governance and management in cultural landscapes, focusing on the case of Takht-e Soleyman World Heritage Site (WHS) in Iran.

The paper presents the results of a study based on a theoretical analysis, accompanied by in-depth interviews with the key actors in the cultural heritage governance and management sectors, and large-scale surveys of the local population through the circulation of questionnaires.

This paper debates the reasons behind and the way forward to make governance and management approaches consistent with international theories and national policies. The analysis focuses on rural cultural landscapes and accordingly the Takht-e Soleyman WHS is deeply investigated.

The policies for participatory governance and management of rural cultural landscapes have been raised in the literature. However, more attention has to be paid to the strategies and mechanisms based on local features for their implementation. The study detailed in this paper makes a contribution to the debate on the design and implementation of participatory governance and management systems in this field by examining the actual extent of successful implementation of theoretical values and national policies in the case of Takht-e Soleyman WHS.